! flx252xv.s2p 4/90 ! FLX252XV ! @10V-600mA ! .1GHZ 18GHZ 20 ! S-parameters include bonding wires: ! gate : total 8 wires, 1 per bond pad, 0.2mm long each wire. ! drain : total 8 wires, 1 per bond pad, 0.2mm long each wire. ! source: no bond wire, gold plated hole (via-hole) to backside of chip. ! wire : 25u dia., gold. # GHZ S MA R 50 .100 .997 -30.5 14.534 163.4 .006 74.2 .260 -167.4 .500 .968 -107.6 8.766 120.7 .019 34.7 .390 -161.6 1.000 .957 -139.9 5.052 100.0 .022 17.9 .438 -163.8 2.000 .954 -159.5 2.597 80.9 .022 7.0 .481 -162.0 3.000 .955 -166.6 1.701 68.4 .021 2.9 .527 -159.5 4.000 .957 -170.3 1.236 57.9 .020 1.5 .576 -158.1 5.000 .960 -172.7 0.950 48.7 .018 2.2 .625 -157.8 6.000 .962 -174.4 0.757 40.4 .017 4.9 .671 -158.2 7.000 .965 -175.8 0.618 32.8 .015 9.6 .711 -159.1 8.000 .967 -176.9 0.514 25.9 .014 16.3 .747 -160.3 9.000 .969 -177.9 0.434 19.6 .014 24.6 .779 -161.6 10.000 .971 -178.7 0.370 13.9 .014 33.5 .805 -163.0 11.000 .973 -179.5 0.319 8.7 .014 42.0 .828 -164.4 12.000 .974 179.7 0.277 4.0 .015 49.6 .848 -165.8 13.000 .975 179.0 0.242 -0.3 .017 55.7 .865 -167.1 14.000 .976 178.4 0.212 -4.2 .018 60.6 .879 -168.4 15.000 .977 177.7 0.187 -7.8 .020 64.3 .892 -169.6 16.000 .978 177.1 0.165 -10.9 .022 67.2 .903 -170.7 17.000 .979 176.6 0.146 -13.7 .024 69.4 .912 -171.9 18.000 .979 176.0 0.130 -16.1 .026 71.1 .920 -172.9